SOC 17-2131.00
Materials Engineers — H-1B sponsors
Employers filing Labor Condition Applications under SOC 17-2131.00, ranked by filings in this occupation.
- Sponsors
- 100
- Filings
- 601
- Job titles
- 150
- Median wage
- $123,810
Distinct employers among the top 100 for this occupation
Applications those employers filed under this SOC code
Distinct titles employers gave the same occupation
Offered wage, derived from $5,000 bands
1,270 disclosed positions
Top sponsors
Ranked by filings under this occupation, not by company size.
Intel Corporation
Santa Clara, CA · Semiconductor and Electronic Component Manufacturing
318this role
1,121 lifetime
last filed FY2026
Apple Inc.
Cupertino, CA · Computer and Peripheral Equipment Manufacturing
38this role
3,969 lifetime
last filed FY2026
Applied Materials, Inc
Santa Clara, CA · Semiconductor and Electronic Component Manufacturing
38this role
182 lifetime
last filed FY2026
ASM AMERICA INC.
PHOENIX, AZ · Manufacturing
10this role
31 lifetime
last filed FY2026
Headway Technologies, Inc.
Milpitas, CA · Semiconductor and Electronic Component Manufacturing
9this role
22 lifetime
last filed FY2026
Samsung Austin Semiconductor, LLC
Austin, TX · Semiconductor and Electronic Component Manufacturing
9this role
85 lifetime
last filed FY2026
Western Digital Technologies, Inc.
San Jose, CA · Computer and Peripheral Equipment Manufacturing
8this role
93 lifetime
last filed FY2026
GlobalFoundries U.S., Inc.
Malta, NY · Semiconductor and Electronic Component Manufacturing
7this role
33 lifetime
last filed FY2026
Micron Technology, Inc.
Boise, ID · Semiconductor and Electronic Component Manufacturing
7this role
108 lifetime
last filed FY2026
The University of Chicago
Chicago, IL · Colleges, Universities and Professional Schools
7this role
146 lifetime
last filed FY2026
Lam Research Corporation
Fremont, CA · Semiconductor and Electronic Component Manufacturing
6this role
49 lifetime
last filed FY2026
Nova Measuring Instruments Inc.
Fremont, CA · Semiconductor and Electronic Component Manufacturing
5this role
13 lifetime
last filed FY2026
Job titles filed under this code
The title is whatever the employer wrote on the application. Nothing here is reclassified or normalised.
| Job title as filed | Filings | Positions | Employers |
|---|---|---|---|
| Process Engineer | 332 | 749 | 5 |
| Packaging Engineer | 16 | 16 | 1 |
| Process Support Engineer | 9 | 85 | 1 |
| Materials Engineering | 8 | 8 | 1 |
| Postdoctoral Research Associate | 8 | 8 | 6 |
| Research Scientist | 8 | 8 | 7 |
| Postdoctoral Scholar | 7 | 7 | 4 |
| MATERIALS ENGINEER | 6 | 6 | 5 |
| Reliability Engineering | 6 | 6 | 1 |
| Hardware Development | 4 | 4 | 1 |
| IC Packaging Engineering | 4 | 4 | 1 |
| Research Associate | 4 | 4 | 3 |
| Senior Engineer | 4 | 4 | 1 |
| Staff Engineer, Hardware Development Engineering | 4 | 52 | 1 |
| Field Process Engineer | 3 | 3 | 1 |
Where this role is filed
Metro areas with enough disclosed wages to report a range for this occupation.
Ranking and totals are computed over the 100 largest sponsors of this occupation, which is what the precomputed ranking holds. Filing counts are applications, and position counts are worker positions on those applications — neither is a headcount, because a continued-employment application renews someone who is already here. Wage distribution for this occupation.